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Title:
Hardenability epoxy resin constituent
Document Type and Number:
Japanese Patent JP6010550
Kind Code:
B2
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JP6232714An epoxy resin constituent, a sealing agent, and an optical semiconductor device
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Inventors:
Akihiro Shibamoto
Shin Takemoto
Application Number:
JP2013551628A
Publication Date:
October 19, 2016
Filing Date:
December 18, 2012
Export Citation:
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Assignee:
Daicel Corporation
International Classes:
C08L63/00; C08G59/24; C08G59/26; H01L23/29; H01L23/31
Domestic Patent References:
JP2010053199A
JP2009249569A
JP2000344867A
JP2012077129A
JP2007320974A
Foreign References:
WO2006019041A1
WO2010013407A1
WO2010090246A1
Attorney, Agent or Firm:
Yukihisa Goto



 
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