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Title:
An epoxy resin constituent, a sealing agent, and an optical semiconductor device
Document Type and Number:
Japanese Patent JP6232714
Kind Code:
B2
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Inventors:
Endo Mitsuteru
Application Number:
JP2013046425A
Publication Date:
November 22, 2017
Filing Date:
March 08, 2013
Export Citation:
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Assignee:
Zeon Corporation
International Classes:
C08G59/20; C08G59/42; C08K5/09; C08K5/49; C08L63/00; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
JP2013028790A
JP2006265274A
JP5222165A
JP2007099901A
JP2012219155A
JP2012197341A
Foreign References:
WO2013008680A1
Attorney, Agent or Firm:
Haruhito Oishi



 
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