Title:
HEAT CONDUCTING BASE BOARD, MANUFACTURING METHOD THEREOF, POWER SUPPLY UNIT, AND ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2008021817
Kind Code:
A
Abstract:
To provide a heat conducting base board hardly influenced by noises, to provide a manufacturing method thereof, to provide a power supply unit, and to provide electronic equipment.
The heat conducting base board consists of metal plates 17 each having one or more holes, a sheet-like heat transfer resin layer 11 fixed on the metal plate 17, lead frames 10 embedded in the heat transfer resin layer 11, and a printed wiring board 20 provided in the hole of the metal plate 17. A part of the lead frames 10 is bent toward the holes, the bent portions 13 pierce through the heat transfer resin layer 11 and is electrically connected to the printed wiring board.
Inventors:
TSUJIMOTO ETSUO
TSUMURA TETSUYA
NISHIYAMA KIMIHARU
TSUMURA TETSUYA
NISHIYAMA KIMIHARU
Application Number:
JP2006192317A
Publication Date:
January 31, 2008
Filing Date:
July 13, 2006
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K1/02; H01L23/12; H01L25/04; H01L25/18; H05K7/20; H05K9/00
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano