Title:
HEAT INSULATION FILM FORMATION METHOD
Document Type and Number:
Japanese Patent JP2014138951
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat insulation film formation method capable of enhancing adhesion force between a heat insulation film which has low heat conductivity and low heat capacity and a base material of a cylinder block and the like.SOLUTION: An admixture 4 formed by mixing a hollow particle 2 and a binder 3 is coated on a die surface of a molding tool K. A solvent included in the binder 3 of the admixture 4 is removed for forming a heat insulation film intermediate body 9 having a crack G going from a surface 4a toward a surface 4b of the admixture 4 on a mold surface of a molding tool K. A molten metal 6 is impregnated into the molding tool K for impregnating the molten metal 6 in the crack G of the heat insulation film intermediate body 9. And curing the molten metal 6 is performed for form removal of the integrated molten metal 6 and the heat insulation film intermediate body 9, and a heat insulation film 5 formed by impregnating a part of a base material 7 in the crack G and curing, is formed on a surface of the base material 7.
Inventors:
EDA AKINORI
SUGIYAMA NATSUKI
SUGIYAMA NATSUKI
Application Number:
JP2013008671A
Publication Date:
July 31, 2014
Filing Date:
January 21, 2013
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
B22D19/08; B22C3/00; B22D27/18; C04B37/02; C23C26/00
Domestic Patent References:
| JPH0475758A | 1992-03-10 | |||
| JPS60127067A | 1985-07-06 | |||
| JPS5626667A | 1981-03-14 | |||
| JPS51145429A | 1976-12-14 | |||
| JP2010185291A | 2010-08-26 |
Attorney, Agent or Firm:
Yusuke Hiraki
Sekiya Mitsuo
Ishikawa Takiharu
Naoki Takemura
Sekiya Mitsuo
Ishikawa Takiharu
Naoki Takemura
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