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Title:
HEAT RADIATING MEMBER, AND MODULE USING THE SAME
Document Type and Number:
Japanese Patent JP2010238753
Kind Code:
A
Abstract:

To provide a heat radiating member in which positional accuracy of a conductive plate with respect to an insulating substrate is high, and which has excellent heat resistance cycle characteristics, and to provide a module using the same.

The heat radiating member includes the insulating substrate, and the conductive plate of which one main surface is bonded to a main surface of the insulating substrate. The conductive plate includes a projection part, which continues along a peripheral edge line of the one main surface and a peripheral edge line of the other main surface and projects outside from the peripheral edge line of the one main surface and the peripheral edge line of other main surface, on a circumferential surface.


Inventors:
YUGUCHI AKIO
Application Number:
JP2009082546A
Publication Date:
October 21, 2010
Filing Date:
March 30, 2009
Export Citation:
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Assignee:
KYOCERA CORP
International Classes:
H01L23/36
Domestic Patent References:
JP2005116602A2005-04-28
JPH11233903A1999-08-27
JP2007109995A2007-04-26
JP2006060054A2006-03-02
JP2005116602A2005-04-28
JPH10190176A1998-07-21