Title:
HEAT RADIATION MATERIAL
Document Type and Number:
Japanese Patent JP2017105922
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting heat radiation material having high thermal conductivity.SOLUTION: A heat radiation material comprises a resin composition comprising an episulfide compound having a mesogenic skeleton, a curing agent and/or a curing accelerator, and a highly thermal conductive filler, where, a content of the episulfide compound is 65 wt.% or more in the resin composition excluding the highly thermal conductive filler.SELECTED DRAWING: None
Inventors:
TAKEDA KOHEI
Application Number:
JP2015240346A
Publication Date:
June 15, 2017
Filing Date:
December 09, 2015
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08L81/02; C08G75/08; H01L23/29; H01L23/31; H01L23/373
Attorney, Agent or Firm:
Atomi International Patent Office