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Title:
HEAT-SEALING LID MATERIAL EXCELLENT IN ADHESIVE STRENGTH
Document Type and Number:
Japanese Patent JP2015037966
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat-sealing lid material which is formed by laminating a heat adhesive layer having excellent productivity while preventing deterioration of an adhesive strength caused by heat in a production process and irradiation with ultraviolet rays.SOLUTION: A heat-sealing lid is formed by sequentially laminating a base material layer 2 having a gas barrier layer 5, an anchor coat agent layer 3 and a heat adhesive layer 4. The heat adhesive layer contains a styrene/maleic resin.

Inventors:
TOBITA KENGO
NODA TSUNEHIRO
Application Number:
JP2013237881A
Publication Date:
February 26, 2015
Filing Date:
November 18, 2013
Export Citation:
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Assignee:
TOYO INK SC HOLDINGS CO LTD
International Classes:
B65D77/20; B32B27/00; B32B27/30; C08F255/00; C08F283/02; C09J125/04; C09J133/00; C09J151/06; C09J151/08; C09J167/00; C09J167/08
Domestic Patent References:
JP2005022173A2005-01-27
JP2010065196A2010-03-25
JPH11198278A1999-07-27
JPH10237412A1998-09-08
JP2000071404A2000-03-07
JP2006306110A2006-11-09
JP2000328033A2000-11-28
JP2010536944A2010-12-02
JPH0250146B21990-11-01
JPH09263749A1997-10-07
JP2008221606A2008-09-25
JP2000007032A2000-01-11
JP2004115089A2004-04-15
Foreign References:
US20100255228A12010-10-07



 
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