HEAT-SHRINKABLE FILM, PACKAGING MATERIAL, MOLDING OR CONTAINER

Title:

HEAT-SHRINKABLE FILM, PACKAGING MATERIAL, MOLDING OR CONTAINER

Document Type and Number:

Japanese Patent JP2022063244

Kind Code:

A

Abstract:

To provide a heat-shrinkable film that has excellent rigidity and heat shrinkability and can be easily torn by hand along perforations even when the heat-shrinkable film is made thinner; and to provide packaging materials including the heat-shrinkable film, and a molding or a container having the packaging materials attached thereto.SOLUTION: A heat-shrinkable film has at least one layer comprising a resin composition (Z) primarily composed of a polyester resin (A), the heat-shrinkable film satisfying the following a) and b). a) The polyester resin (A) contains a copolyester resin. b) The birefringence ΔN is 0.055 or more and 0.100 or less.SELECTED DRAWING: None

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Inventors:

MUTA TAKATOSHI

Application Number:

JP2021164677A

Publication Date:

April 21, 2022

Filing Date:

October 06, 2021

Export Citation:

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Assignee:

MITSUBISHI CHEM CORP

International Classes:

C08J5/18; B65D65/02; B65D65/40

Attorney, Agent or Firm:

Nishihiko Yasuhiko
井▲崎▼ 愛佳
Yuko Nishito
Shigeyasu Terao

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