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Title:
HEAT SINK AND ELECTRONIC EQUIPMENT HAVING IT
Document Type and Number:
Japanese Patent JP2002076664
Kind Code:
A
Abstract:

To provide a heat sink which can be reduced in size and thickness and, at the same time, can be improved remarkably in heat dissipating effect at a low cost.

This heat sink 30 which is attached to equipment 10 to dissipate heat from a heat generating section 70 in the equipment 10 to the outside of the equipment 10 is provided with a heat pipe 50 the one end section of which is arranged at the same position as that of the heat generating section 70, a heat diffusing member 100 which is arranged between the heat pipe 50 and heat generating section 70, and a heat transfer sheet or grease in at least either one of a first junction 91 between the heat pipe 50 and heat diffusing member 100 and a second junction 92 between the member 100 and heat generating section 70.


Inventors:
OGASAWARA JUNICHI
KAYAMA TAKASHI
HASHIMOTO TOSHIO
Application Number:
JP2000258144A
Publication Date:
March 15, 2002
Filing Date:
August 23, 2000
Export Citation:
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Assignee:
SONY CORP
International Classes:
F25D9/00; H05K7/20; (IPC1-7): H05K7/20; F25D9/00
Attorney, Agent or Firm:
Oka-saki-Shintaro (1 person outside)



 
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