HIGH EXPANSION SEAL BONDING MATERIAL

Title:

HIGH EXPANSION SEAL BONDING MATERIAL

Document Type and Number:

Japanese Patent JPS5684340

Kind Code:

A

Abstract:

PURPOSE: To enhance the waterproof of the titled material by adding a specified amount of alkaline earth metal, alkali metal and zinc oxides, alumina, boric acid and silica to a specified amount of P2O5 as a principal component.

CONSTITUTION: This high expansion seal bonding material has a composition contg. ≥95mol% in total of component A and component B. Component A is 40W75mol% P2O5, and component B is 20W55mol% in total of two or more among ≤55mol% BaO, ≤55mol% CaO, ≤20mol% ZnO and ≤20mol% MgO as essential components and three or less among 0W20mol% Na2O, 0W20mol% K2O, 0W 10mol% Al2O3, 0W10mol% B2O3 and 0W10mol% SiO2.

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Inventors:

KONDOU KAZUO
TAKAMI AKIO

Application Number:

JP15782279A

Publication Date:

July 09, 1981

Filing Date:

December 05, 1979

Export Citation:

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Assignee:

NGK SPARK PLUG CO

International Classes:

C03C3/062; C03C3/16; C03C8/08; C03C8/24; (IPC1-7): C03C3/16; C03C3/30

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