Title:
HIGH-FREQUENCY MODULE
Document Type and Number:
Japanese Patent JP2020125927
Kind Code:
A
Abstract:
To obtain a miniaturized high-frequency module.SOLUTION: A high-frequency module 100X is provided with: a high-frequency circuit board 20 on which a high-frequency circuit 3 for generating and outputting a high-frequency signal, and an antenna 30 for transmitting the high-frequency signal output from the high-frequency circuit 3 and receiving a reflected wave of the transmitted high-frequency signal are arranged; and a control board 21 on which a control circuit 4 for performing radar signal processing based on the reflected wave received by the antenna 30 is arranged; and herein, the high-frequency circuit board 20 and the control board 21 are stacked.SELECTED DRAWING: Figure 2
Inventors:
IKI SHUNSUKE
KAMIMURA TATSUYA
KAMIMURA TATSUYA
Application Number:
JP2019017239A
Publication Date:
August 20, 2020
Filing Date:
February 01, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G01S7/03; H01Q1/52; H01Q23/00; H04B1/38
Attorney, Agent or Firm:
Jun Takamura