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Title:
HIGH-HEAT CONDUCTIVE THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2013032451
Kind Code:
A
Abstract:

To provide a thermoplastic resin composition having a very high heat conductivity as compared to general-purpose plastics, and simultaneously being excellent extrusionability and blow moldability.

The high-heat conductive thermoplastic resin composition comprises a thermoplastic polyesteric resin, a high-heat conductive inorganic compound having a heat conductivity as a single substance of ≥5 W/mK, and a copolymer obtained by copolymerizing 30 to 100 wt% of methyl methacrylate, 0 to 70 wt% of a (meth)acrylate ester excluding methyl methacrylate, and 0 to 20 wt% of a vinylic monomer copolymerizable therewith, and having a specific viscosity of 0.5 to 7 as measured at 30°C by dissolving 0.4 g of the copolymer is dissolved in 100 cc of toluene.


Inventors:
UCHIDA SOICHI
MATSUMOTO KAZUAKI
Application Number:
JP2011169570A
Publication Date:
February 14, 2013
Filing Date:
August 02, 2011
Export Citation:
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Assignee:
KANEKA CORP
International Classes:
C08L67/00; C08F220/14; C08K3/00; C08L33/04
Domestic Patent References:
JPS6389554A1988-04-20
JP2005248089A2005-09-15
Foreign References:
WO2006121011A12006-11-16
WO2007066711A12007-06-14
WO2008146400A12008-12-04