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Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2013032450
Kind Code:
A
Abstract:

To provide: a pressure-sensitive adhesive composition that includes an oxyalkylene polymer having at least one silicon-containing group which has a hydroxyl or hydrolyzable group bonded to the silicon atom and can be crosslinked through the formation of a siloxane bond; a tackifier resin; and a curing catalyst, wherein the pressure-sensitive adhesive composition has less coloring and good releasability, good curability and good adhesive characteristics.

The pressure-sensitive adhesive composition includes, as essential components: (A) an oxyalkylene polymer having at least one silicon-containing group which has a hydroxyl or hydrolyzable group bonded to the silicon atom and can be crosslinked through the formation of a siloxane bond; (B) a tackifier resin other than a phenolic compound; and (C) a titanium compound.


Inventors:
MAIZURU NOBUYOSHI
Application Number:
JP2011169568A
Publication Date:
February 14, 2013
Filing Date:
August 02, 2011
Export Citation:
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Assignee:
KANEKA CORP
International Classes:
C09J171/02; C09J11/06; C09J201/00
Domestic Patent References:
JPS60219280A1985-11-01
JPS62146959A1987-06-30
JP2008115348A2008-05-22
Foreign References:
WO2005073333A12005-08-11
WO2005108500A12005-11-17