To provide a holding table constituted simple and capable of holding a held article regardless of size and shape, restraining electric power for working, etc. and reducing cost, a processing device of the held article and a processing device of a semiconductor wafer.
This holding table is furnished with a base 40 provided on a processing table 3 of a back grinding device 1, a dent hole 41 formed recessed in a flat surface circular shape on a surface of the base 40, a deformable holding layer 43 to closely hold the semiconductor wafer W free to connect and disconnect by covering the dent hole 41 and an exhaust passage 44 to exhaust air in the dent hole 41 covered with the holding layer 43 outside in accordance with driving of a vacuum pump 45. It is possible to continuously adhere the semiconductor wafer W of a small bore diameter as the air does not leak even when the semiconductor wafer of less than the set size, etc. is used as it is by setting a size of the holding layer 43 so as to correspond with the size of the semiconductor wafer W.
IZUMI TADASHI
ODAJIMA SATOSHI
HOSONO NORIYOSHI
TANAKA KIYOBUMI
SHINETSU POLYMER CO
| JP2005327758A | 2005-11-24 | |||
| JP2004288962A | 2004-10-14 | |||
| JP2005255960A | 2005-09-22 |
Masayoshi Kanda
Akio Miyao