To obtain a hot melt adhesive composition having improved adhesion at a high temperature while keeping the adhesion at a low temperature and a low melt viscosity by including a specific proportions of ethylene copolymer, a specified tackifying resin and a specific wax.
This hot melt adhesive composition is obtained by formulating (A) 5-94wt.% ethylenic copolymer preferably of a copolymer of ethylene, and 10-60wt.% vinyl ester of a monocarboxylic acid and/o acrylic ester, having 0.1-1,000 melt flow rate (based on ASTM-1238), (B) 5-90wt.% tackifying resin having 140-170°C softening point and (C) 1-40wt.% Fischer-Tropsch wax. The component B is obtained by reacting (i) a rosin phenol resin with (ii) a polyhydric alcohol of the amount capable of esterifying about 10-100 equivalent % of the carboxyl group in the component (i) in an inert gas in the presence (absence) of an esterification catalyst at 150-300°C for 2-10hr, and removing the formed water from the product.
ISHIMOTO TSUKASA
MIYAMOTO TAKUO
ARAKAWA CHEM IND