How to form an insulation pattern - Konica Minolta Co., Ltd.

Title:

How to form an insulation pattern

Document Type and Number:

Japanese Patent JP6361659

Kind Code:

B2

Abstract:

The purpose of the present invention is to provide an insulation pattern forming process by which a desired pattern can be easily formed in patterning an insulation layer (3) by an ink-jet method. In patterning an insulation layer (3) by an ink-jet method, according to the insulation pattern forming process of the present invention, an insulation layer forming ink is applied to a substrate (1) so as to satisfy the requirement: (viscosity after landing on the substrate)/(viscosity at ejection) ≥ 100. The insulation layer forming ink has a phase change mechanism of hot melting, thixotropy or gelation.

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Inventors:

Masayoshi Yamauchi

Application Number:

JP2015525302A

Publication Date:

July 25, 2018

Filing Date:

July 04, 2014

Export Citation:

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Assignee:

Konica Minolta Co., Ltd.

International Classes:

B05D1/26; B05D5/12; B05D7/24; G06F3/044; H05K1/11; H05K3/22

Domestic Patent References:

JP6049399A
JP2005126507A
JP2003105241A
JP2003089261A
JP2010231287A
JP2005007266A
JP2007319821A
JP2012061658A
JP2011178832A
JP2010182776A
JP2006140376A

Foreign References:

WO2012077432A1
WO2005027601A1

Attorney, Agent or Firm:

Eiichi Maruyama

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