Title:
【発明の名称】樹脂封止型半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP2915892
Kind Code:
B2
Abstract:
A resin molded type semiconductor device has: a semiconductor chip ( 12 ) which is mounted on a die pad portion ( 11 ) of a lead frame ( 9 ); thin metal wires ( 14 ) which connect terminals of the semiconductor chip ( 12 ) to inner lead portions ( 13 ) of the lead frame ( 9 ); and a sealing resin ( 15 ), and the lead frame ( 9 ) is subjected to an upsetting process so that a supporting portion ( 11 ) is located at a position higher than the inner lead portions ( 13 ). Since the sealing resin of a thickness corresponding to the step difference of the upsetting exists below the supporting portion, the adhesiveness between the lead frame and the sealing resin can be improved, and high reliability and thinning are realized. Since at least one groove portion is disposed in the surface of each of the inner lead portions ( 13 ), the anchoring effect to the sealing resin ( 15 ), stress acting on a lead portion of a product, and stress to the thin metal wires ( 14 ) can be relaxed, and leads and the thin metal wires can be prevented from peeling off.
Inventors:
MINAMIO MASANORI
KONISHI SATOSHI
MORISHITA YOSHIHIKO
YAMADA JUICHIRO
ITO FUMITO
KONISHI SATOSHI
MORISHITA YOSHIHIKO
YAMADA JUICHIRO
ITO FUMITO
Application Number:
JP7371198A
Publication Date:
July 05, 1999
Filing Date:
March 23, 1998
Export Citation:
Assignee:
MATSUSHITA DENSHI KOGYO KK
International Classes:
H01L23/28; H01L23/31; H01L23/495; H01L23/50; (IPC1-7): H01L23/50; H01L23/28
Domestic Patent References:
| JP6104364A | ||||
| JP54106776U | ||||
| JP6142856U |
Attorney, Agent or Firm:
Miyai Akio