Title:
【発明の名称】光半導体装置の樹脂封止方法
Document Type and Number:
Japanese Patent JP2810343
Kind Code:
B2
Inventors:
Kazumi Morimoto
Application Number:
JP33758495A
Publication Date:
October 15, 1998
Filing Date:
December 25, 1995
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L23/28; H01L21/56; (IPC1-7): H01L21/56; H01L23/28
Domestic Patent References:
| JP3141677A | ||||
| JP1305547A | ||||
| JP160560U |