Title:
【発明の名称】スラグと連結導体の間に銀-銅結合層を含む、ガラス中に封止された型の半導体装置
Document Type and Number:
Japanese Patent JPH10501375
Kind Code:
A
Abstract:
The invention relates to a semiconductor device of the type sealed in glass, comprising a semiconductor body having a pn-junction between opposing faces which are connected to slugs of a transition metal, said slugs being connected to copper-containing connection conductors by a bonding layer, the bonding layer comprising, in addition to copper and silver, more than 1 wt. % germanium.
Inventors:
Juan Aken Timothes Johannes Maria
Application Number:
JP52822696A
Publication Date:
February 03, 1998
Filing Date:
March 11, 1996
Export Citation:
Assignee:
Philips Electronics Nemrose Fennaught Shap
International Classes:
H01L23/29; H01L21/60; H01L23/051; H01L23/08; H01L23/31; H01L23/48; H01L23/488; H01L23/492; H01L29/861; (IPC1-7): H01L23/48; H01L23/29; H01L23/31; H01L29/861
Attorney, Agent or Firm:
Akihide Sugimura (6 others)