Title:
IC MODULE INLET, IC CARD, AND IC CARD MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2005250875
Kind Code:
A
Abstract:
To improve flatness on the surface of an IC card and its resistibility against bending.
An IC module inlet 4 has an IC chip 2 and an antenna coil 3 connected to the IC chip 2 on a base material 5. One end of the antenna coil 3 is connected to the other end via through-holes 6 and 7 formed on the base material 5, and the thickness of the through-hole A is 3 to 20 μm.
Inventors:
KOJIMA NORIYOSHI
Application Number:
JP2004060679A
Publication Date:
September 15, 2005
Filing Date:
March 04, 2004
Export Citation:
Assignee:
KONICA MINOLTA PHOTO IMAGING
International Classes:
G06K19/07; G06K19/077; (IPC1-7): G06K19/07; G06K19/077
Attorney, Agent or Firm:
Toshio Tsuruwaka
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