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Title:
INJECTION MOLDING DEVICE AND FORMING METHOD OF COMPOSITE FOR RESIN BONDING-TYPE MAGNET
Document Type and Number:
Japanese Patent JP2007287764
Kind Code:
A
Abstract:

To provide an injection molding device and a forming method of a composite for resin bonding-type magnet, with which thermosetting resin can be injected while a leakage phenomenon that thermosetting resin leaks from a nozzle is controlled at the time of measuring the composite for resin bonding-type magnet and it can continuously and stably be manufactured.

The injection molding device of the composite for resin bonding-type magnet is provided with a means supplying the composite for resin bonding-type magnet, where thermosetting resin is set to be a binder component of magnetic powder, into a cylinder, the cylinder receiving the composite for resin bonding-type magnet, which is sent, and melting it, a screw with check valve, which sends the received composite for resin bonding-type magnet in front of the cylinder and measures it and the nozzle supplying the measured composite for resin bonding-type magnet to a confronted mold and filling a cavity with it. The device is also provided with a means with which the screw with check valve performs sucking back before the composite for resin bonding-type magnet is measured.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
HAYASHI SHINICHI
OMORI KENJI
SATO TAKASHI
Application Number:
JP2006110410A
Publication Date:
November 01, 2007
Filing Date:
April 13, 2006
Export Citation:
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Assignee:
SUMITOMO METAL MINING CO
International Classes:
H01F1/08; B22F3/00; B22F3/02; H01F41/02
Attorney, Agent or Firm:
Kenji Kawabi