RESIN-SEALED SEMICONDUCTOR DEVICE

Title:

RESIN-SEALED SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP2007287765

Kind Code:

A

Abstract:

To provide a structure of an outer lead suitable for securing lead recognition property and solder wettability while resin adhesiveness is secured in a resin-sealed semiconductor device.

In the semiconductor device 100, a lead frame 30 and a semiconductor element 20 are electrically connected and they are sealed with molded resin 50. A surface of an inner lead 31 is formed of a roughened plated film 331 roughened much more than a surface of a base material 30a of the lead frame 30 and an outer lead 32 is soldered with a printed board. A surface of the outer lead 32 is formed of a roughened plated film 332 roughened much more than the surface of the base material 30a of the lead frame 30. Roughness of the roughened plated film 331 in the inner lead 31 is made higher than that of the roughened plated film 332 in the outer lead 32.

Inventors:

MIZUTANI KOJI
HIROSE SHINICHI
HARADA YOSHIHARU

Application Number:

JP2006110449A

Publication Date:

November 01, 2007

Filing Date:

April 13, 2006

Export Citation:

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