Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2007287766
Kind Code:
A
Abstract:
To remarkably prevent a short-circuit caused by the contact of a bonding wire and a heat sink due to a wire drop in a semiconductor device where a semiconductor loaded on the heat sink and a lead frame positioned at its periphery are wire-bonded.
In the semiconductor device, a semiconductor chip 20 loaded on one face of the heat sink 10 and the lead frame 40 positioned at the periphery are bonded by the bonding wire 50. A fixing part 41 of the lead frame 40 is caulked and fixed to one face of the heat sink 10. The fixing part 41 of the lead frame 40 is bent in a direction where a lead 42 of the lead frame 40 to which the bonding wire 50 is connected is detached from one face of the heat sink 10.
COPYRIGHT: (C)2008,JPO&INPIT
Inventors:
OBATA HIROYUKI
Application Number:
JP2006110450A
Publication Date:
November 01, 2007
Filing Date:
April 13, 2006
Export Citation:
Assignee:
DENSO CORP
International Classes:
H01L23/50; H01L23/28
Attorney, Agent or Firm:
Yoji Ito
Takahiro Miura
Fumihiro Mizuno
Takahiro Miura
Fumihiro Mizuno