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Patent Searching and Data


Title:
INK FOR FORMING CONDUCTOR PATTERN, CONDUCTOR PATTERN, AND WIRING BOARD
Document Type and Number:
Japanese Patent JP2011190353
Kind Code:
A
Abstract:

To provide an ink for forming a conductor pattern which can be stably discharged from a liquid droplet discharge head and prevent the occurrence of defective continuity in the formed conductor pattern, the conductor pattern with a high reliability, and a wiring board provided with such a conductor pattern and being highly reliable.

The ink for forming the conductor pattern is used for forming the conductor pattern on a substrate by the droplet discharge method, and contains metal particles, an aqueous dispersion medium to which the metal particles disperse, and panthenol. In the case that the particle size distribution if measured from a small particle size, when the particle size in the point of X% of the entire volume is assumed as D(X) by the cumulative volume, D(50) of the metal particle is 10 nm or more and 40 nm or less, and the particle size D(90) is 40 nm or more and 100 nm or less.


Inventors:
MORIYAMA HIDEKAZU
TAKIGUCHI HIROSHI
DENDA ATSUSHI
TOYODA NAOYUKI
HAMA YOSHIKAZU
Application Number:
JP2010057897A
Publication Date:
September 29, 2011
Filing Date:
March 15, 2010
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
B82Y30/00; B82Y99/00; C09D11/02; C09D11/023; C09D11/033; H05K3/10
Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi