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Title:
STICKY ADHESIVE COMPOSITION, STICKY ADHESIVE SHEET, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2011190354
Kind Code:
A
Abstract:

To provide a sticky adhesive composition free of peeling off of a bonded boundary or package cracks even when being exposed to a severe reflow condition in a package mounted with a thin semiconductor chip on an organic substrate having a narrow pitch, and capable of achieving a high package reliability.

The sticky adhesive composition is characterized by containing an acrylic polymer (A), an epoxy resin (B) having a naphthalene skeleton and/or anthracene skeleton, and a curing agent (C).


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Inventors:
ICHIKAWA ISAO
KOYAKATA MASAHIRO
Application Number:
JP2010057920A
Publication Date:
September 29, 2011
Filing Date:
March 15, 2010
Export Citation:
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Assignee:
LINTEC CORP
International Classes:
C09J133/00; C09J7/02; C09J11/00; C09J163/00; H01L21/52
Domestic Patent References:
JP2000265145A2000-09-26
JP2009065191A2009-03-26
JP2006199756A2006-08-03
JPH10251610A1998-09-22
JP2009203478A2009-09-10
JP2011157529A2011-08-18
JP2011187900A2011-09-22
JP2011018806A2011-01-27
JP2000265145A2000-09-26
JP2009065191A2009-03-26
JP2006199756A2006-08-03
JPH10251610A1998-09-22
JP2009203478A2009-09-10
JP2011157529A2011-08-18
JP2011187900A2011-09-22
JP2011018806A2011-01-27
Foreign References:
WO2008132852A12008-11-06
WO2009011281A12009-01-22
Attorney, Agent or Firm:
Patent corporation ssinpat



 
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