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Patent Searching and Data


Title:
INORGANIC FILLER-COMPOUNDED RESIN COMPOSITION AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2004256664
Kind Code:
A
Abstract:

To provide a polyphenylene ether-based resin composition which is reinforced with an organic filler, excellent in rigidity, impact resistance and surface smoothness and effectively used in the fields of automobiles, consumer electrical appliances and OA equipment.

The resin composition is a thermoplastic resin composition consisting of 10-93 pts.wt. of (a) a polyphenylene ether-based resin and, as necessary, a styrene-based resin, 2-20 pts.wt. of (b) a styrene-based thermoplastic elastomer having a functional group and 5-60 pts.wt. of (c) an inorganic filler surface-treated with a silane compound.


Inventors:
OZEKI TOSHIAKI
YAMAGUCHI TORU
Application Number:
JP2003048752A
Publication Date:
September 16, 2004
Filing Date:
February 26, 2003
Export Citation:
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Assignee:
ASAHI KASEI CHEMICALS CORP
International Classes:
C08J3/20; C08K5/521; C08K9/06; C08L25/04; C08L53/02; C08L71/12; (IPC1-7): C08L71/12; C08J3/20; C08K5/521; C08K9/06; C08L25/04; C08L53/02