PURPOSE: To improve the effect of heat-dissipation of an electronic circuit-board, and to reduce trouble, damage, etc. due to a temperature rise of the electronic circuit-board by bringing the surface area of a potting or casting agent to not less than one and a half times as large as the projected area of the electronic circuit-board.
CONSTITUTION: The surface area of a potting or casting agent 2 is brought to not less than one and a half times as large as the projected area of an electronic circuit-board 1. The surface areas such as one of an electronic-part loading surface in the circuit-board 1 and a casting agent 2 layer to which the back is totalized are brought to 1.9 times as large as the total of the projected areas of the electronic-part loading surface in the circuit-board 1 and the back. Accordingly, the effect of heat dissipation from heat-generating parts for an electronic circuit is improved, thus reducing trouble, damage, etc. due to heating.
ISHIKAWA TETSUO
TAKAHASHI TOSHIHIRO
