Title:
一体型セラミックス回路基板製造方法
Document Type and Number:
Japanese Patent JP4674999
Kind Code:
B2
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Inventors:
Ryozo Nonogaki
Takuya Okada
Akira Miyai
Masahiro Ibukiyama
Takuya Okada
Akira Miyai
Masahiro Ibukiyama
Application Number:
JP2001182914A
Publication Date:
April 20, 2011
Filing Date:
June 18, 2001
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
International Classes:
B22D19/00; H05K3/06; C04B37/00; C04B41/88; H01L23/08; H01L23/14; H05K3/00
Domestic Patent References:
| JP200144345A | ||||
| JP2001135902A | ||||
| JP11269578A | ||||
| JP2000277953A | ||||
| JP2001102703A |