Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
INTERLAYER CONNECTING SHEET, AND ITS MANUFACTURING METHOD, AND MULTILAYER FLEXIBLE PRINTED WIRING BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2007165756
Kind Code:
A
Abstract:

To provide an interlayer connecting sheet with a high connecting reliability and an excellent productivity, a method of manufacturing the interlayer connecting sheet, and a multilayer flexible printed wiring board (FPC) using the interlayer connecting sheet.

By using an interlayer connecting sheet 13 constituted by providing: an insulated adhesive sheet 1 having a through-hole 2 at a predetermined position; a copper system core member 6 in a core position, which is inserted in the through-hole 2 in order to obtain a conduction between FPCs and has a diameter smaller than that of the through-hole 2; and a copper system core conductor 5 whose front surface is covered with a solder alloy layer, a plurality of FPCs are stuck each other to manufacture multilayer FPCs. Since a front surface of the copper system core conductor 5 is made of a solder alloy, the solder alloy of the copper system core conductor 5 front surface is pressurized and deformed in case of laminating each wiring layer, and the copper system core conductor 5 can be certainly and electrically connected. Moreover, as the copper system core conductor 5 is inserted in through-hole 2 provided in the thickness direction, a cross section and an electric conductivity in a conductive area can be fully ensured, and the multilayer FPC with the high connecting reliability can be obtained.


Inventors:
OGATA SHIGEKI
YOSHINO TOYOICHI
MORIMOTO SHINJI
NAKAJIMA KOJI
Application Number:
JP2005363015A
Publication Date:
June 28, 2007
Filing Date:
December 16, 2005
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K3/46; H05K1/11; H05K3/40
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano