Title:
PRINTED WIRING BOARD, AND ITS CONNECTION STRUCTURE
Document Type and Number:
Japanese Patent JP2007165752
Kind Code:
A
Abstract:
To provide a printed wiring board whose intensity to a peeling stress is large, and whose junction intensity can be largely increased.
This flexible wiring board 1 is provided with a pattern forming region 5 from which conductor patterns 3A for connection of a plurality of conductor patterns 3 are exposed and pattern non-formation regions 6 and 6 at the both sides in the width direction of the pattern formation region 5 in which any conductor pattern 3 is not formed at the edge part of an insulating substrate 2, wherein a slit 7 notched from the end section(end edge) of the insulating substrate 2 is formed between the pattern formation region 5 and the pattern non-formation regions 6 at the both sides.
Inventors:
TAKAMI MAKOTO
TSURUGA SATORU
MARUO HIROKI
TSURUGA SATORU
MARUO HIROKI
Application Number:
JP2005362947A
Publication Date:
June 28, 2007
Filing Date:
December 16, 2005
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
H05K1/14
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Shunichi Takahashi
Iwa Saki Kokuni
Kawamata Sumio
Shunichi Takahashi