To provide a wiring board for sufficiently achieving the insulation property of a substrate surface and the radiation property of the wiring board.
An alumite layer 2 as a metal oxide insulating layer is formed on the surface of an aluminum substrate 1 as a metal board, and a heat conductive resin insulating layer 3 is formed on the surface of the alumite layer 2 at the opposite side of the aluminum substrate 1, and a wiring section 7 is formed on the surface of the heat conductive resin insulating layer 3 at the opposite side of the alumite layer 2. Then, the alumite layer 2 is provided with recesses 4a and 4b of at least one type of a hole and a crack on the surface, and the heat conductive resin insulating layer 3 is formed in such a status that it enters the recesses 4a and 4b.
ONO KAORU
ISHIDA TAKUYA
UNIV KANTO GAKUIN SURFACE ENG RES INST
AIN CORP LTD
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