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Patent Searching and Data


Title:
JOINING METHOD FOR PIN AND PLATE
Document Type and Number:
Japanese Patent JPS57209791
Kind Code:
A
Abstract:

PURPOSE: To improve strength and reliability as a mechanical part and reduce the size of mechanical part by fitting a pin into a hole of a plate and irradiating a laser from the direction perpendicular to the end face of the pin.

CONSTITUTION: A round pin 1 is fitted into a hole of a metallic plate and irradiated by a laser from the direction nearly perpendicular to the end face of the pin 1. In this case, as joining can be made by a straight pin 1, and there is metallic joining part due to welding, joining strength is improved remarkably. When the diameter of the hole of the metallic plate 2 is larger than that of the pin 1, there are gaps C1 and C2 and the light leaks from the gaps C1, C2 to cause deposition on the rear side of the metallic plate. To prevent this phenomenon, laser irradiation is made from the direction that makes the angle θ1 of incidence to be 5W30°. By this way, the light is subjected to repeated reflection between the thickness of the matallic plate and attenuated. Thus, deposition on the rear side can be prevented.


Inventors:
SAITOU SUSUMU
KITAYAMA YOSHIFUMI
MURAKAMI SHIYUUICHI
KUBOTA KAZUO
Application Number:
JP9425381A
Publication Date:
December 23, 1982
Filing Date:
June 17, 1981
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B23K26/21; (IPC1-7): B23K26/00
Domestic Patent References:
JPS49105750A1974-10-07
JPS5192766A1976-08-14