To provide a joint device of a packaged component, an alignment device of a substrate, and an alignment method, capable of improving production efficiency with a simplified device configuration.
The joint device of packaged component comprises a work table 52 on which a first substrate is placed in a positioned state and a second substrate is placed in a temporal positioned state with respect to the first substrate; work conveying means 51 for conveying both substrates via the worktable 52 in one direction of each station; alignment means 53 disposed on an alignment station for receiving the second substrate in the temporal positioned state from the work table 52, positioning the second substrate to the first substrate, and further delivering the second substrate after positioned to the work table 52; and thermocompression means 54 disposed on a pressure bonding station, facing the work table 52 on which both positioned substrates are placed, and connecting both substrates on the work table 52 through terminals.
COPYRIGHT: (C)2007,JPO&INPIT
