METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

Title:

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

Document Type and Number:

Japanese Patent JP2007242888

Kind Code:

A

Abstract:

To provide a method of manufacturing an accurate semiconductor package which can reduce a cost by increasing a manufacturing efficiency and a yield, and can achieve high-level and more functions by making the package compact and thin, and manufacturing the package with a high density.

A device substrate member 2 having a device 4 and an electrode 10 formed on a semiconductor substrate 3 is integrally formed with a rewiring layer substrate member 5 having a rewiring layer 7 formed on a light-transmitting dummy substrate 6 with a release film 24 disposed therebetween. Thereafter, the release layer 24 is heated by irradiating the resultant structure with a laser beam from the side of the dummy substrate 6 to release the dummy substrate 6 with the release layer 24 as an interface.

Inventors:

NAKAYAMA HIROKAZU
OGAWA TAKESHI
MIYAZAKI HIROHITO
TAKESHIMA NAMIKO

Application Number:

JP2006063119A

Publication Date:

September 20, 2007

Filing Date:

March 08, 2006

Export Citation:

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Assignee:

SONY CORP

International Classes:

H01L23/12

Domestic Patent References:

JP2002076576A	2002-03-15
JP2006019425A	2006-01-19

Foreign References:

WO2005036632A1	2005-04-21
WO2003007379A1	2003-01-23

Attorney, Agent or Firm:

Akira Koike
Eiichi Tamura
Seiji Iga

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