PURPOSE: To obtain a laminated board for a printed circuit having excellent formability and heat resistance by incorporating inorganic filler to be mixed, which has a median particle size of a range of 5-20μm and a particle size distribution width present in a range of ±5μm of the range of the median particle size.

CONSTITUTION: Predetermined materials are mixed to form uniform varnish. Then, glass woven fabric is 50 impregnated with the vanish that resin content amount becomes 42-45%, and dried to obtain a glass woven fabric prepreg. Subsequently, inorganic filler of a predetermined mixture to 100 pts. of the varnish resin is added, agitated to form inorganic filler-containing varnish. Silica and aluminum hydroxide which have 10μm of the median particle size and ±5.0μm or less of a particle size distribution width, are used. A glass nowoven fabric base material is so impregnated with the filler-containing varnish that the contents of the resin and the filler become 90% of the entire prepreg, and dried to obtain prepreg. Then, a copper-clad laminated board having 1.6mm of thickness is obtained.