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Title:
LAMINATED BOARD WITH METAL FOIL PLATED ON ITS BOTH SURFACES AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH11254591
Kind Code:
A
Abstract:

To prevent a metal foil surface, a specular plate surface, and a press disc surface from fouling due to molten resin by using a metal foil having smaller dimension than that of a prepreg at least on one surface of the prepreg to then be heat compressed in superimposition with the prepreg in a manner that the prepreg is exposed over the entire circumference of the metal foil.

The metal foil 2 is preferably formed in that the circumference of prepreg 1 is of 3-15 mm in width, i.e., has dimensions of size capable of forming a part 5 not being covered by the metal foil 2 for ease of cutting down edge parts and positioning because of the end of the prepreg 1 exposed as the metal foil 2 is superimposed on the prepreg 1. That is, the metal foil 2 having smaller dimensions than that of the prepreg 1 is used for one surface of the prepreg 1; however, the dimensions of metal foil in another surface are available either in larger or smaller than that of the prepreg 1. Conditions of heat and compression depend on a temperature, pressure, and time in accordance with thermosetting resin respectively used in the prepreg.


Inventors:
KATO AKIRA
OYA KATSUHIKO
KATAOKA KAZUO
KIKUCHI KIYOSHI
KINOSHITA HIROYUKI
Application Number:
JP6373098A
Publication Date:
September 21, 1999
Filing Date:
March 13, 1998
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H05K3/38; B32B15/08; B32B37/10; (IPC1-7): B32B15/08; B32B31/20; H05K3/38
Attorney, Agent or Firm:
Hirose Akira