積層セラミック電子部品及びその製造方法

Japanese Patent JP7322240

B2

To provide a multilayer ceramic electronic component also having moisture resistance and impact resistance.SOLUTION: A multilayer ceramic electronic component comprises a ceramic element body. The ceramic element body includes: a lamination part; a side margin part; and a ridge part. The lamination part includes: a capacitance formation part including a plurality of ceramic layers laminated to a first direction, and a plurality of inner electrodes arranged to between a plurality of ceramic layers; a cover part covering the capacitance formation part from the first direction; and a side surface directed to a second direction orthogonal to the first direction, and to which the plurality of inner electrodes is exposed. The side margin part covers the side surface of the lamination part. The ridge part is extended to a third direction orthogonal to the firs and second directions, and has a round shape. The capacitance formation part includes: a first region arranged in a central part of the first direction; and a second region arranged to between a cover part and the first region. In the second region, an end part of the second direction of the plurality of inner electrodes is positioned in an inner side of the second direction from the first region.SELECTED DRAWING: Figure 4

JP2022049235	DIELECTRIC THIN FILM ELEMENT AND ELECTRONIC CIRCUIT DEVICE
JPS60194324	[Title of the device] Lamination chip capacitor
JP2000269073	MULTILAYER CERAMIC CAPACITOR AND MANUFACTURE THEREOF

Ryo Ohno
Fukuoka Tetsuhiko
Masashi Kusumoto
Akihiko Kohno

JP2022079928A

August 07, 2023

May 16, 2022

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TAIYO YUDEN CO.,LTD.

H01G4/30

JP59034622A
JP2000124064A
JP2017157754A
JP61248413A
JP2002299146A
JP2005259772A
JP201091285A

Shuhei Katayama

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