To improve transmission characteristic of a laminated chip component at, particularly, a high frequency by reducing resistance loss of a conductor path of the component.

On a cross section of the conductor path (segments 22B and 22I constituting the conductor path) of a laminated chip coil, widths W11 of intermediate conductor layers 18B3 and 18I3 are the broadest, and the widths W12 of conductor layers 18B2, 18B4, 18I2, and 18I4 on the outsides of the layers 18B3 and 18I3 are narrower than those of the layers 18B3 and 18I3. In addition, the widths W13 of conductor layers 18B1, 18B5, 18I1, and 18I5 on the outsides of the conductor layers 18B2, 18B4, 18I2, and 18I4 are narrower than those of the layers 18B2, 18B4, 18I2, and 18I4. Segments 22B and 22I are formed to have almost circular cross sections by making centers of the conductor layers 18 in their widthwise directions almost coincident with each other in the planar direction (perpendicular to the direction of lamination) and appropriately adjusting the widths of the layers 18. When the laminated chip coil is constituted in this way, the cross section of the conductor path of the coil becomes almost circular and the resistance loss of the path is reduced.