Title:
LAMINATION DEVICE AND METHOD OF FORMING INSULATION LAYER
Document Type and Number:
Japanese Patent JP2013247326
Kind Code:
A
Abstract:
To provide a lamination device in which a support base film can be peeled efficiently at a low running cost, and to provide a method of forming an insulation layer using the same.
The method of forming an insulation layer on a wiring circuit board by using a lamination device includes a laser welding step for welding a transport film and a support base film by means of laser, and a stripping step for completing transfer of an insulation resin layer on the support base film to the wiring circuit board by stripping the transport film on the front and back from the wiring circuit board.
Inventors:
CHINO MASAAKI
Application Number:
JP2012121745A
Publication Date:
December 09, 2013
Filing Date:
May 29, 2012
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
H05K3/46; H05K3/00
Domestic Patent References:
| JP4525180B2 | 2010-08-18 | |||
| JP2010147123A | 2010-07-01 |