Title:
LAND GRID ARRAY AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP3223653
Kind Code:
B2
Abstract:
PURPOSE: To provide a land grid array for achieving a high-density packaging and its manufacturing method.
CONSTITUTION: The title land grid array consists of an electronic parts mounting part 70 provided on a surface side surface and a resin insulation layer 1 provided at the outer periphery of the electronic parts mounting part 70. A via hole 75 which is electrically connected to a pad 58 for packaging provided on the reverse side and a lower pattern 56 which is electrically connected to the via hole 75 provided at the surface side surface are provided. A hole part 15 for pattern is provided at a resin insulation layer 1. An upper pattern 53 which is electrically connected to the lower pattern 56 is provided at the hole part 15 for pattern. The upper pattern 53 is electrically connected to the bonding pad 51 provided around the electronic parts mounting part 70.
Inventors:
Teruo Hayashi
Kozo Kodama
Kozo Kodama
Application Number:
JP18894293A
Publication Date:
October 29, 2001
Filing Date:
June 30, 1993
Export Citation:
Assignee:
IBIDEN Co., Ltd.
International Classes:
H05K1/02; H05K3/46; (IPC1-7): H05K3/46; H05K1/02
Domestic Patent References:
| JP6149493A | ||||
| JP62242341A | ||||
| JP5326747A |
Attorney, Agent or Firm:
Yoshiyasu Takahashi