Title:
LASER BEAM MACHINING APPARATUS, WORKING MASK, LASER BEAM MACHINING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3842769
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus, which restrains peeling-off and cracking of an insulation film.
SOLUTION: The laser beam machining apparatus is provided with: a moving mechanism 9, which moves an object 20 to be machined in the scanning direction running from one end of the object 20 to the other end opposite to the one end; a beam-shape converting part 4, which converts a laser beam to a working laser beam having an asymmetrical shape about the scanning direction on a plane orthogonal to the optical axis of the laser beam; and an irradiation optical system 6, by which the object 20 is irradiated with the laser beam emitted from the beam-shape converting part 4.
More Like This:
Inventors:
Hiroshi Ikegami
Makoto Sekine
Makoto Sekine
Application Number:
JP2003309338A
Publication Date:
November 08, 2006
Filing Date:
September 01, 2003
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
B23K26/066; B23K26/00; B23K26/06; B23K26/073; B23K26/364; H01L21/301; H01L21/302; H01L21/304; H01L21/311; H01L21/78; B23K101/40; (IPC1-7): B23K26/06; H01L21/301; H01L21/302; //B23K101:40
Domestic Patent References:
| JP2001345536A | ||||
| JP2000117465A | ||||
| JP8019887A | ||||
| JP9327782A | ||||
| JP8220559A | ||||
| JP2003037218A | ||||
| JP2002224878A | ||||
| JP2002324768A | ||||
| JP7246487A | ||||
| JP2001144035A | ||||
| JP364043A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Nakamura Tomoyuki
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Nakamura Tomoyuki
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Previous Patent: DEVICE AND METHOD FOR SERVICE RETRIEVAL
Next Patent: DEVICE FOR WINDING SHUTTER OR THE LIKE
Next Patent: DEVICE FOR WINDING SHUTTER OR THE LIKE