Title:
LASER BEAM MACHINING DEVICE FOR SILICON SUBSTRATE
Document Type and Number:
Japanese Patent JP3727548
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a laser beam machining device preventing the splashing of a molten silicon, excellent in machining accuracy, and capable of effectively conducting perforation processing for a silicon substrate.
SOLUTION: The laser beam machining device for the silicon substrate is provided with a characteristics detecting part 13, a machining position determining part 14-1, a machining position storing part 14-2, a machining treatment determining part 14-3, a machining patterns determining part 14-4 for selecting a machining pattern for conducting perforating after applying the reforming treatment, in the case that a perforated hole is not present within the radius of 80 μm of a processing start position, and selecting the machining pattern for conducting perforating without applying the reforming treatment, in the case that the perforated hole is present within the radius of 80 μm of the processing start position, a machining control part 15, and a machining part 16.
Inventors:
Ryuta Araki
Honda Shinichi
Honda Shinichi
Application Number:
JP2001134866A
Publication Date:
December 14, 2005
Filing Date:
May 02, 2001
Export Citation:
Assignee:
Sumitomo Precision Products Co., Ltd.
International Classes:
B23K26/00; B23K26/03; B23K26/382; B81C99/00; G01C19/56; G01C19/5684; H01L21/02; B23K101/40; (IPC1-7): B23K26/03; B23K26/00; B23K26/38; G01C19/56; G01P9/04; H01L21/02
Domestic Patent References:
| JP2002324768A | ||||
| JP4167985A | ||||
| JP11083498A | ||||
| JP4324706A | ||||
| JP8146029A |
Attorney, Agent or Firm:
Michio Mori
Terutada Hogami
Terutada Hogami