Title:
LASER PEENING DEVICE AND METHOD
Document Type and Number:
Japanese Patent JP2022067857
Kind Code:
A
Abstract:
To provide a laser peening device and a laser peening method capable of applying compressive stress to the interior of a hole that is sealed at its one end, such as a cooling hole in a mold, etc.SOLUTION: A laser peening device that performs laser peening on the inner surface of a cooling hole 20 whose one end is sealed includes a laser oscillator 1 that emits pulsed laser light, a laser light condensing mechanism (condensing lens unit) 5 that condenses the pulsed laser light 2, a fluid supply mechanism 6 for supplying fluid 18 to the inside of the cooling hole 20, a nozzle 9 that can be inserted into the cooling hole 20 and allows the pulsed laser beam 2 and the fluid 18 to pass through the inside, and a suction mechanism 11 that sucks the fluid 18 from the fluid supply mechanism 6 and fills the irradiation portion of the pulsed laser beam 2 with the fluid 18.SELECTED DRAWING: Figure 1
Inventors:
SENDA ITARU
SHIIHARA KATSUNORI
IMAZAKI KAZUTO
SHIIHARA KATSUNORI
IMAZAKI KAZUTO
Application Number:
JP2020176697A
Publication Date:
May 09, 2022
Filing Date:
October 21, 2020
Export Citation:
Assignee:
TOSHIBA CORP
TOSHIBA ENERGY SYSTEM & SOLUTION CORP
TOSHIBA ENERGY SYSTEM & SOLUTION CORP
International Classes:
B23K26/356; B23K26/03; B23K26/146; B23K26/16; C21D7/06
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office