Title:
LASER PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2022184406
Kind Code:
A
Abstract:
To provide a laser processing device that can efficiently divide a work-piece, while suppressing functional layers laminated on the work-piece from being peeled off.SOLUTION: In a laser processing device, a laser beam emitting unit 20 includes: a first branching unit 23 that branches a laser beam 21 emitted from a laser oscillator 22 into a first light path 30 and a second light path 40; a first light collector 32 that collects the laser beam 21 guided to the first light path 30; a second light collector 42 that collects the laser beam 21 guided to the second light path 40; a second branching unit 31, arranged on the first light path 30 between the first branching unit 23 and the first light collector 32, which branches the laser beam 21 into at least two laser beams 21; and a laser beam scanning unit 41, arranged on the second light path 40 between the first branching unit 23 and the second light collector 42, which scans the laser beams 21 and guides the beams to the second light collector 42.SELECTED DRAWING: Figure 2
Inventors:
SHIONO KOJI
KAMIYAMA HARUKI
KAMIYAMA HARUKI
Application Number:
JP2021092232A
Publication Date:
December 13, 2022
Filing Date:
June 01, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B23K26/082; B23K26/067; H01L21/301
Attorney, Agent or Firm:
Sakai International Patent Office
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