PURPOSE: To provide a method of laser trimming of a resistor wherein a device is not brought into failure even with a laser displaced in its irradiation point.

CONSTITUTION: In resistors R1,R2... of parallel devices, laser irradiation is initiated from about a center between the adjacent devices located upstream and the resistors are irradiated with the laser in the opposite direction to the direction of trimming. At the time correction of resistances of the resistors is completed, the laser irradiation is interrupted. Even if any outside cutting is caused owing to point displacement of the laser irradiation, the trimming is performed in the order where resistance of a device with time outside cutting is corrected, and the resistance does not exceed a target value.