Title:
積層体、絶縁フィルム、電子回路及び積層体の製造方法
Document Type and Number:
Japanese Patent JP4349600
Kind Code:
B2
Abstract:
The present invention is directed to a laminate having a layer construction of metal-insulating layer-metal or a layer construction of metal-insulating layer, which laminate meets conditions for developing large adhesive strength between the insulating layer and the metal, as well as to an insulating film and an electronic circuit using the laminate. The laminate has a layer construction of first metal layer/insulating layer/second metal layer or a layer construction of metal layer/insulating layer. The insulating layer 1 has a multilayer structure of two or more layers. The layers on the side of the adhesive interface with each metal layer (a copper foil 3 and an SUS foil 4), out of the layers constituting the insulating layer 1, each are a thermoplastic resin layer 2. The minimum value of the storage modulus at a temperature at or above Tg of the thermoplastic resin layer 2 is not more than 106 Pa.
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Inventors:
Katsuya Sakayori
Application Number:
JP2000119418A
Publication Date:
October 21, 2009
Filing Date:
April 20, 2000
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
B32B15/088; B32B15/08; H05K1/03; H05K3/00; H05K3/38
Domestic Patent References:
| JP10340973A | ||||
| JP62053827A |
Attorney, Agent or Firm:
Yoshihiko Mitsurai