Title:
LEAD FRAME CONVEYER
Document Type and Number:
Japanese Patent JPS61290727
Kind Code:
A
Abstract:
PURPOSE:To reciprocate a feeding means of a lead frame conveying apparatus with one side of a lead frame clamped by a closed feeding clamp, by composing the feeding means of a feeding clamp and a fixing clamp opposed to each other. CONSTITUTION:A lead frame 4 is shifted to a position where it can be clamped by a feeding clamp 5 and positioned there accurately by a conveying mechanism such as a roller of a front chute 2. The lead frame 4, clamped and fixed by the feeding clamp 5, can be fed out correctly in a given pitch in the direction as indicated by the arrow by means of a cam mechanism. A fixing clamp 6, which is opened during this feeding operation, is closed after the lead frame 4 has been fed through given pitches by the feeding clamp 5 so that the fixing clamp 6 in turn clamps and fixes the lead frame. The feeding clamp 5 is then released and is returned to its original position as it is opened. The feeding clamp 5 can be returned without positionally deviating the lead frame 4, because it is fixed by the fixing clamp 6.
Inventors:
KAWADA YASUO
MIMATA TSUTOMU
KAWAMURA MIKIYOSHI
MIMATA TSUTOMU
KAWAMURA MIKIYOSHI
Application Number:
JP13180785A
Publication Date:
December 20, 1986
Filing Date:
June 19, 1985
Export Citation:
Assignee:
HITACHI LTD
HITACHI TOKYO ELECTRONICS
HITACHI TOKYO ELECTRONICS
International Classes:
B23P19/00; B65G47/90; H01L21/50; (IPC1-7): B23P19/00; B65G47/90; H01L21/50
Attorney, Agent or Firm:
Katsuo Ogawa
Previous Patent: FORMATION OF INSULATION FILM AND APPARATUS THEREFOR
Next Patent: SEMICONDUCTOR MANUFACTURE APPARATUS
Next Patent: SEMICONDUCTOR MANUFACTURE APPARATUS