Title:
SEMICONDUCTOR MANUFACTURE APPARATUS
Document Type and Number:
Japanese Patent JPS61290728
Kind Code:
A
Abstract:
PURPOSE:To improve the manufacturing efficiency and to automatize the manufacture completely, by transferring carriers on which semiconductor devices are arranged in a plane among various manufacturing process sections so that the semiconductor devices are subjected to manufacturing processes in these sections as they are mounted on the carriers. CONSTITUTION:In a pellet bonder 11, frames 1, bases 2 and semiconductor element pellets 3 are assembled to provide incomplete semiconductor devices 4. These incomplete semiconductor devices 4 are mounted on a carrier 5 by a handling mechanism 17 such that they are arranged on a plane. A plurality of such carriers 5 are received in a rack 18 and the racks 18 are stocked in a stocker 12. The carriers 5 are sequentially taken out of the stocker 12 and transferred onto a belt means 19 to be conveyed toward a wire bonder 13. When a carrier 5 reaches the position B, an X-Y table 22 and a pusher 23 operate to bond wires onto the semiconductor devices 4. The carrier 5 is then returned to the belt means 19 and is conveyed to an unloader 14 where the carrier is received again in the racks 18.
Inventors:
TAKASHIMA KAZUHISA
OZAWA MASAKAZU
HOSHINO TOSHIO
KOMABA YUICHI
FUJIWARA SHUNICHI
YOSHIDA MASAHIKO
SASAKI SATOSHI
SHIRAKAWA SEIICHI
OZAWA MASAKAZU
HOSHINO TOSHIO
KOMABA YUICHI
FUJIWARA SHUNICHI
YOSHIDA MASAHIKO
SASAKI SATOSHI
SHIRAKAWA SEIICHI
Application Number:
JP13186285A
Publication Date:
December 20, 1986
Filing Date:
June 19, 1985
Export Citation:
Assignee:
HITACHI LTD
HITACHI TOKYO ELECTRONICS
AKITA DENSHI KK
HITACHI TOKYO ELECTRONICS
AKITA DENSHI KK
International Classes:
H01L21/50; (IPC1-7): H01L21/50
Attorney, Agent or Firm:
Katsuo Ogawa