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Patent Searching and Data


Title:
LEAD FRAME FOR LED LIGHT-EMITTING ELEMENT, LED PACKAGE USING THE SAME, AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2013077728
Kind Code:
A
Abstract:

To easily manufacture a lead frame for mounting LED light-emitting element that is free of warpage by combining a plurality of kinds of material.

When a resin-made reflector is provided together so that a substrate including an element mounting part for LED light emitting element and a lead part having an electric connection area for making electric connection with the LED light emitting element has high light reflectivity of an LED light source, layers constituting the element mounting part and lead part are made of metallic materials, and a reflector is manufactured by combining several kinds of materials while using an insulating material such as thermosetting resin. Even if the material in use differ in coefficient of linear expansion, groove parts are previously provided at parts which are mechanically cut when LED packages are cut into individual pieces, and molded together in reflector molding.


Inventors:
TODA JUNKO
MANIWA SUSUMU
SAWADAISHI MASASHI
Application Number:
JP2011217198A
Publication Date:
April 25, 2013
Filing Date:
September 30, 2011
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD
International Classes:
H01L33/62; H01L23/48