To provide an LED package which makes peeling less likely to occur between a sealing resin and a white insulation resin even when the LED package deteriorates due to long time use and the sealing resin is shrunk, prevents the deterioration from quickly proceeding, and is excellent in maintaining mechanical strength and optical performance, and to provide a manufacturing method of the LED package.
A lead frame member has at least one to multiple pad parts for mounting an LED chip and an electric connection area for making electrical connection with the LED chip and is made of a metal thin plate. An LED package is formed by integrating a resin molding part having a cavity structure, which encloses the pad part and the electric connection area, with the lead frame member. The LED package has a groove at a position that encloses the opening of the cavity structure.
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TODA JUNKO
SAWADAISHI MASASHI
